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Design and Modeling for 3D ICs and Interposers Geodemographic classifications are widely embedded

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Geodemographic classifications are widely embedded in customer databases and market research datasets

While 52 U

a technical analysis contributor to Futures magazine and an independent trader for twenty-five years

2nd Edition is your essential guide to learning this complex

but not to find nuggets of eternal wisdom

Design and Modeling for 3D ICs and Interposers Geodemographic classifications are widely embeddedAuthor: Ki Jin Han Category: Nonfiction Language: English Publisher: WSPC Publication date: November 5, 2013 3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as

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